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The effect of post-cure heating on residual, unreacted monomer in a commercial resin composite

机译:后固化加热对市售树脂复合材料中残留的未反应单体的影响

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Objectives. This paper examined the influence of post-cure temperature on the amount of unreacted monomer remaining in a commercial light-cured resin composite restoration following initial light-curing and subsequent post-cure heating. Methods. Discs of composite were light-cured and then subjected to immediate post-cure heating (50,75,100, or 125 deg. C for 7 min) or were Left unheated (control). They were then placed in a solvent for two weeks at 37 deg. C to extract the unreacted monomer. HPLC analysis was used To determine the amounts of TEGDMA, BIS-GMA, and ethoxylated BIS-GMA remaining after the different treatments. The amounts of each Monomer leaching were compared using ANOVA with respect to the different curing treatments.
机译:目标。本文研究了初始光固化和随后的后固化加热后固化温度对市售光固化树脂复合材料修复体中残留的未反应单体数量的影响。方法。将复合材料的光盘进行光固化,然后立即进行后固化加热(50,75,100或125℃持续7分钟)或不加热(对照)。然后将它们在37度的溶剂中放置两周。 C萃取未反应的单体。使用HPLC分析来确定不同处理后剩余的TEGDMA,BIS-GMA和乙氧基化BIS-GMA的量。对于不同的固化处理,使用ANOVA比较每种单体浸出的量。

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