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机译:集料表面性质对芯片密封件保持性能的影响
Department of Civil Engineering of Erciyes University, 38039 Kayseri, Turkey;
Department of Civil Engineering of Istanbul University, Istanbul, Turkey;
Department of Civil Engineering of Suleyman Demirel University, Isparta, Turkey;
Department of Civil Engineering of Afyon Kocatepe University, Afyonkarahisar, Turkey;
Department of Civil Engineering of Bozok University, Yozgat, Turkey;
Chip seal; Retention; Adhesion; Performance;
机译:碎屑橡胶作为骨料在创新型芯片密封堆焊中的保留行为
机译:碎石密封层下路面的附着力和界面粘结强度的研究:沥青-骨料组合和冻融循环对碎石密封的影响
机译:芯片密封渣作为芯片密封的环境性能和功能分析
机译:骨料大小对常规和橡胶芯片密封保留的影响
机译:使用扫掠和长期性能测试研究芯片密封聚集体的保留。
机译:白蛋白处理PDMS微流控芯片的表面性能研究
机译:乳液沥青的物理特性与芯片密封路面骨料骨料的影响
机译:在mn / ROaD处评估集料和芯片密封表面道路