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Influence of silica fume and low curing temperature on mechanical property of cemented paste backfill

机译:二氧化硅烟气和低固化温度对水泥浆料回填机械性能的影响

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The cementing cost accounts for 75 percent of the total operations costs in a mine if cement is used as cemented material. Silica fume (SF), as potential cementitious material, can be used as a substitute of cement to fabricate cemented paste backfill (CPB). In this study, experimental studies were executed to investigate the mechanical properties and microstructure evolution of CPB incorporating SF and in an effort to assess the applicability of using SF as a partial cement replacement in cold region. The cement replacement level was set at 0% (control), 2.5%, 5.0% and 10.0% by the mass of cement. Furthermore, the effect of curing temperature (similar to 1, 6, and 20 degrees C) on mechanical and microstructural performance of CPB within 28 days was also studied. Results indicate that the optimal replacement level of 5.0% for CPB exhibit the highest compressive strength regardless of curing temperature and age. The low curing temperature retards hydration reaction, and the strength of CPB samples with silica fume cured at room temperature is higher than that cured at 6 degrees C and -1 degrees C, however, the 28-day strength of CPB with 5% silica fume at low curing temperature (similar to 1 degrees C) is larger than that CPB without silica fume at room temperature. The strength incremental rate induced by replacement of silica fume at early age (e.g., 3 days) is more significant in comparison with that cured for 28 days. The microstructural results indicate that more hydration products (e.g. C-S-H, ettringite, and CH) are generated as silica fume dosage and curing temperature increases, thereby resulting in refinement of pore structure and improvement of CPB strength. (C) 2020 Elsevier Ltd. All rights reserved.
机译:如果水泥用作粘合材料,胶结成本占矿井总运营成本的75%。作为潜在的水泥材料,硅烟灰(SF)可用作制造粘贴浆料回填(CPB)的水泥的替代品。在该研究中,执行实验研究以研究CPB的CPB掺入SF的机械性能和微观结构演化,并努力评估使用SF作为寒冷区域的部分水泥替代品的适用性。通过水泥的质量设定为0%(对照),2.5%,5.0%和10.0%的液体置换水平。此外,还研究了固化温度(类似于1,6和20摄氏度)在28天内对CPB机械和微观结构性能的影响。结果表明,无论固化温度和年龄如何,CPB的最佳替代水平为5.0%表现出最高的抗压强度。低固化温度延迟水化反应,并在室温下固化CPB样品的CPB样品的强度高于6摄氏度固化,然而,CPB的28天强度为5%二氧化硅烟雾在低固化温度(类似于1℃)的温度下大于室温下没有二氧化硅烟气的CPB。与固化28天的固化相比,通过替换二氧化硅烟污诱导的强度增量率更显着。微观结构结果表明,产生更多的水合产物(例如C-S-H,Ettringite和Ch)作为二氧化硅烟雾剂量和固化温度升高,从而产生孔隙结构和CPB强度的提高。 (c)2020 elestvier有限公司保留所有权利。

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