New low application temperature hot melt

摘要

Beardow Adams' new BAM Futura 23 is a low application temperature hot melt adhesive that can be applied at 130℃. "The norm is around 160℃. Low temperature hot melts are popular because of associated energy savings and perceived safety advantages, but relative to conventional hot melts they have not been especially good at bonding," says Beardow Adams' R&D manager Paul Addison. PIRA, the independent UK research association, tested the adhesive and reported that it gave 100% fibre tear when they hand-ruptured test bonds at temperatures from -25° to 23℃ on a 375g per m~2 FS-Karton Neuss Mill board. PIRA also tested BAMFutura 23 for resistance to creep at 23℃ over seven days without failures.