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DEM simulation of bonded granular material. Part II: Extension to grain-coating type methane hydrate bearing sand

机译:粘结颗粒材料的DEM模拟。第二部分:扩展到谷物包裹型含甲烷水合物砂

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摘要

In free gas environment, methane hydrate (MH) tends to grow on sand grain surfaces and forms cementations (bonds) at contacts where the MH coating layers overlap. This grain-coating type growth habit of hydrate endows methane hydrate bearing sediment (MHBS) with special mechanical behavior. This study first examines the mechanics of grain-coating type MHBS based on previously reported experimental results. Then, three particle-scale mechanisms are proposed, i.e. contact cementation (MH acting as bonds at contacts), particle enlargement (MH coating grain surface and thus increasing effective particle size) and particle angulation (the presence of rough fracture surface when a MH bond is broken). The three mechanisms are implemented into a bonded contact model for the discrete element simulations of MHBS. Grain angularity, MH growth habit and mechanical properties of MH are incorporated in the bonded contact model in a consistent way. The simulation results show that the experimentally observed effects of MH saturation and test conditions (temperature and pore pressure) on MHBS behavior can be well reproduced, thus validating the three proposed mechanisms. Cementation effect can be fully seen under very low stress state, whereas under in-situ stress conditions for MHBS, cementation only influences the small-strain behavior. Particle enlargement and angulation are dominant to control strength and dilation of MHBS. (C) 2016 Elsevier Ltd. All rights reserved.
机译:在自由气体环境中,甲烷水合物(MH)倾向于在砂粒表面上生长,并在MH涂层重叠的接触处形成胶结(键)。水合物的这种颗粒涂层型生长习性赋予了甲烷水合物含沉积物(MHBS)特殊的机械性能。这项研究首先根据先前报道的实验结果检查了颗粒涂层型MHBS的力学。然后,提出了三种颗粒尺度机制,即接触胶结(MH在接触处充当键),颗粒扩大(MH覆盖晶粒表面并因此增加了有效粒径)和颗粒成角度(当MH键存在时存在粗糙的破裂表面)被打破)。这三种机制被实现为键合接触模型,用于MHBS的离散元件仿真。 MH的晶粒角,MH的生长习性和机械性能以一致的方式纳入了键合接触模型。仿真结果表明,可以很好地再现实验观察到的MH饱和度和测试条件(温度和孔隙压力)对MHBS行为的影响,从而验证了所提出的三种机理。在非常低的应力状态下可以完全看到胶结作用,而在MHBS的原位应力条件下,胶结作用仅影响小应变行为。颗粒的扩大和成角作用是控制MHBS强度和膨胀的主要因素。 (C)2016 Elsevier Ltd.保留所有权利。

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