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The electro-mechanical behavior of conductive filler reinforced polymer composite undergone large deformation: A combined numerical-analytical study

机译:导电填料增强的聚合物复合材料的大变形机电行为:组合数值分析研究

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The electro-mechanical performance of flexible strain sensors under large deformation is of great concern due to their applications in measuring large strain. In this paper, we develop a combined numerical-analytical approach to study the electro-mechanical behavior of conductive filler reinforced polymer composite under uniaxial tensile load. This developed approach couples the displacement field of the microstructure and the evolution of the micro circuit. A 2D micromechanical representative volume element model is used to simulate the deformation and strain field in the composite, taking into consideration the random distribution of conductive aggregates and the hyperelastic mechanical properties of the polymer matrix. We then predict the evolution of electrical resistance using the tunneling conduction theory and transfer-matrix approach, based on the strain distribution of the material under various tensile deformations. The numerical results agree well with experimental results in terms of different material parameters and tensile conditions. This suggests the developed model is capable of predicting the nonlinear electro-mechanical response of the studied material under large deformation and revealing the effect of particle mass fraction on the electro-mechanical performance. The present approach can be served as a useful tool in the design and improvement of conductive filler-polymer composites for flexible strain sensor application. (C) 2017 Elsevier Ltd. All rights reserved.
机译:挠性应变传感器在大变形下的机电性能由于其在测量大应变中的应用而备受关注。在本文中,我们开发了一种组合的数值分析方法来研究导电填料在单轴拉伸载荷下的聚合物复合材料的机电行为。这种发达的方法将微结构的位移场和微电路的演化耦合在一起。考虑到导电聚集体的随机分布和聚合物基体的超弹性力学性能,使用二维微机械代表体积元模型模拟复合材料的变形和应变场。然后,我们根据材料在各种拉伸变形下的应变分布,使用隧穿传导理论和传递矩阵方法预测电阻的演变。在不同的材料参数和拉伸条件下,数值结果与实验结果吻合良好。这表明所开发的模型能够预测所研究材料在大变形下的非线性机电响应,并揭示出颗粒质量分数对机电性能的影响。本方法可以用作设计和改进用于柔性应变传感器应用的导电填料-聚合物复合材料的有用工具。 (C)2017 Elsevier Ltd.保留所有权利。

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