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Identification and estimation of defects in high-speed ground C/SiC ceramic matrix composites

机译:高速研磨C / SiC陶瓷基复合材料中缺陷的识别与估计

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Carbon fibre reinforced silicon carbide (C/SiC) composites are excellent load bearing composites which have additional thermal protection capabilities. Manufacturing and grinding of such ceramic composites without defects is difficult and it eventually affects their loading capacity. The present work proposes means to control grinding induced defects in CVI (chemical vapor infiltration) prepared C/SiC composite by utilizing high-speed grinding. SEM was used to characterize the ground surface morphology. The depth of fibre delamination and defect volume were quantified using an X-ray micro-CT technique. For fibres orthogonal to the ground surface, high grit forces owing to high undeformed chip thickness were found responsible for defect formation. Such fibres contained fibre-matrix delamination up to a depth of 400 mu m from the ground surface. For the other two orientations (with mutually orthogonal fibres in the grinding plane), the grinding scallop and the chip thickness at the machined surface governed the formation of defects. Due to lower grit forces at the machined surface and crack-deflection property of such composites, the defects in the latter orientations remained confined only to the machined surface. High grinding speed of 200 m/s yielded 60% less defects in the composite because of lower grit forces and grit interaction.
机译:碳纤维增强碳化硅(C / SiC)复合材料是优异的承载复合材料,具有额外的热保护能力。这种陶瓷复合材料的制造和研磨难以缺陷,并且最终影响它们的负载能力。本工作提出了通过利用高速研磨来控制CVI(化学蒸汽渗透)中的研磨诱导缺陷的方法。 SEM用于表征地面形态。使用X射线微型CT技术量化光纤分层和缺陷体积的深度。对于与地面正交的纤维,发现由于缺陷形成负责缺陷的芯片厚度高的高砂力。这种纤维含有纤维 - 基质分层,直到距离地面400μm的深度。对于其他两个取向(在砂轮中的相互正交纤维),磨削扇贝和加工表面的芯片厚度控制着形成缺陷的形成。由于在加工表面的较低的砂砾力和这种复合材料的裂缝偏转性,后一程中的缺陷仍然仅限于加工表面。由于较低的砂砾力和砂砾相互作用,高研磨速度为200m / s的高温速度在复合材料中产生60%较小的缺陷。

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