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Delamination analysis in bimaterials consisting of shape memory alloy and elastoplastic layers

机译:由形状记忆合金和弹塑性层组成的双材料中的分层分析

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摘要

Bimetallic shape memory alloy composites, consisting of an active layer of shape memory alloy and a metallic elastoplastic passive layer, are used for designing the sensors and actuators. Delamination analysis in SMA/elastoplastic bimaterial composites is numerically investigated in this study due to the important effects of interface cracks on failure and load bearing response of such composites. It is known that homogeneous elastoplastic material and shape memory alloy show different path-dependent behaviors for prediction of energy release rate near the crack tip. Therefore, evaluation of J-integral for an interface crack between SMA and elastoplastic layers remains a highly complex issue in fracture analysis of such bimaterials. Presuming small-scale phase transformation and yielding zones, path dependency of J-integral for this composite is investigated for a range of mixed-mode loading conditions, and the elastoplastic material properties including the Young's modulus, hardening slope and yield stress. In addition, the maximum transformation strain within the framework of J(2) plasticity for the elastoplastic material and the thermo-mechanical coupling model of Boyd and Lagoudas for the shape memory alloy are studied. Finally, the influence of mixed-mode loading rates on the crack tip fields is comprehensively assessed.
机译:用于组成的双金属形状记忆合金复合材料,包括形状记忆合金的有源层和金属弹性塑性无源层,用于设计传感器和致动器。由于界面裂缝对这种复合材料的损坏和承载响应的重要效果,在本研究中进行了数值研究了SMA /弹性塑料双材料复合材料的分层分析。已知均匀的弹塑性材料和形状记忆合金显示出不同的路径依赖性行为,用于预测裂纹尖端附近的能量释放速率。因此,在SMA和弹塑性层之间的界面裂缝的J-Integral对界面裂纹的评估仍然是这种双边物的断裂分析中的高度复杂问题。预测小规模的相变和产生区域,研究了该复合材料的J-Integal的路径依赖性,用于一系列混合模式负载条件,以及包括杨氏模量,硬化斜率和屈服应力的弹塑性材料特性。另外,研究了弹性塑料材料的J(2)塑性框架内的最大变换应变和用于形状记忆合金的Boyd和Lagudas的热机械耦合模型。最后,综合评估了混合模式加载速率对裂缝尖端的影响。

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