A Cost-Effective Solution for Packaging the Arrayed Waveguide Grating (AWG) Photonic Components

摘要

Precision laser machining technology was used to cut arrayed waveguide grating (AWG) devices from 6-in wafers by following their complex profiles in a fully automatic way. A substantial cost saving in components manufacturing was achieved by an obtained device-cutting yield of 100%. The profile-cut AWG devices have smooth cutting edges and their optical performances were found unaffected by the cutting. These devices were processed in the subsequent packaging process easily without adding cost. They were proven mechanically stable in their packaging in meeting the telecommunication standards even though they have irregular geometry.