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Leakage Analysis of a Low Power 10 Transistor SRAM Cell in 90 nm Technology

机译:低功耗10晶体管SRAM单元在90 nm技术中的泄漏分析

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摘要

In this paper, a novel 10 Transistor Static Random Access Memory (SRAM) cell is proposed. Read and Write bit lines are decoupled in the proposed cell. Feedback loop-cutting with single bit line write scheme is employed in the 10 Transistor SRAM cell to reduce active power consumption during the write operation. Read access time and write access time are measured for proposed cell architecture based on Eldo SPICE simulation using TSMC based 90 nm Complementary Metal Oxide Semiconductor (CMOS) technology at various process corners. Leakage current measurements made on hold mode of operation show that proposed cell architecture is having 12.31 nano amperes as compared to 40.63 nano amperes of the standard 6 Transistor cell. 10 Transistor cell also has better performance in terms of leakage power as compared to 6 Transistor cell.
机译:本文提出了一种新型的10晶体管静态随机存取存储器(SRAM)单元。读和写位线在建议的单元中解耦。在10晶体管SRAM单元中采用具有单位线写方案的反馈环路切割,以减少写操作期间的有功功耗。在Eldo SPICE仿真的基础上,使用基于TSMC的90 nm互补金属氧化物半导体(CMOS)技术,在各个工艺角,针对提议的单元架构测量了读取访问时间和写入访问时间。在保持工作模式下进行的泄漏电流测量表明,与标准6晶体管电池的40.63纳安相比,建议的电池架构具有12.31纳安。与6晶体管单元相比,在泄漏功率方面,10晶体管单元还具有更好的性能。

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