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首页> 外文期刊>Circuits and Systems II: Express Briefs, IEEE Transactions on >Crosstalk Rejection in 3-D-Stacked Interchip Communication With Blind Source Separation
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Crosstalk Rejection in 3-D-Stacked Interchip Communication With Blind Source Separation

机译:具有盲源分离的3-D堆叠芯片间通信中的串扰抑制

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摘要

A blind source separation (BSS) is proposed to reject the crosstalk between inductive-coupling channels in 3-D systems. The phase and permutation ambiguities inherent to BSS are compensated for in the proposed technique. A continuous-time natural gradient BSS with integrator output swing bounding, which is amenable for high-speed implementation, is also proposed. Techniques to reduce the implementation complexity for a large channel array are presented. The proposed technique shows substantial improvement results for crosstalk rejection in a high-crosstalk-coupling environment. In addition, for a 3 3 array channel with 1 Gb/s/channel, with a crosstalk-to-signal ratio of 3 dB, a bit-error rate of is obtained compared to without BSS.
机译:提出了一种盲源分离(BSS)来拒绝3-D系统中感应耦合通道之间的串扰。 BSS固有的相位和置换模糊度在提出的技术中得到了补偿。还提出了一种适用于高速实现的具有积分器输出摆幅定界的连续时间自然梯度BSS。提出了减少大型通道阵列的实现复杂性的技术。所提出的技术在高串扰耦合环境中显示出显着的串扰抑制效果。另外,对于具有1 Gb / s /通道的3 3阵列通道,串扰与信号的比率为3 dB,与没有BSS的情况相比,获得的误码率为。

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