Bridging the Gap: A Challenge to Laminate Manufacturers

摘要

For most of the history of PCB material, concerns have focused on low cost, impedance and the ability of materials to withstand soldering and rework temperatures. With the advent of gigabit and higher data rates, processors with clocks over 1GHz and rise times faster than 200 picoseconds (which are the characteristics of almost any modern electronic product), concentrating on the afore-mentioned material concerns is not enough. With very high data rates, the frequency dependent nature of dielectrics and traces has begun to play a major role in the quality of signals that are delivered. The three pieces of the puzzle are: 1. The quality of the copper. 2. The quality of the resin system. 3. The quality of weave of the glass cloth.