To be marketed under its beta test name, GHS-51, Uyemura International Corp.'s new technology prevents whisker formation in electroplated tin for 22,000 hours - and longer. Whisker crystals of tin and tin-based alloys are the most common culprits in the short circuiting of electronic components. Most often, the cause of tin whisker formation is compressive stress. The proprietary technology developed by Uyemura dissipates compressive stress, preventing whisker formation.GHS-51 uses a high purity anode, and is ideally suited for connectors and semiconductor lead frames. It offers high deposition speeds for rackless and reel-to-reel processing, and high deposition efficiency over a wide current density range. The bath is lead and fluoride free,
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机译:Uyemura International Corp.的新技术将以其beta测试名称GHS-51进行销售,可防止电镀锡晶须形成长达22,000小时,甚至更长。锡和锡基合金的晶须晶体是电子元件短路的最常见元凶。大多数情况下,锡晶须形成的原因是压应力。 Uyemura开发的专有技术可消除压应力,防止晶须形成。GHS-51使用高纯度阳极,非常适合连接器和半导体引线框架。它为无机架和卷到卷处理提供了高沉积速度,并在宽电流密度范围内提供了高沉积效率。该浴液不含铅和氟,
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