Exhibitions and conferences

摘要

IC package innovation: choosing the right solution TWI, Granta Park, Abington, Cambridge, 26 May 2011 On May 26, TWI hosted an IC Packaging Innovation Conference at Granta Park that had been organised by the National Microelectronics Institute (NMI) with support from the Innovative Electronics Manufacturing Research Centre (IeMRC). The focus of the event was emerging packaging technologies and it began with an introduction and welcome to the capacity audience by Paul Jarvie from NMI. The keynote presentation was then given by Grace O'Malley of iNEMI and was entitled, 'Technology trends and roadmaps for packaging innovation". Grace began with an overview of iNEMI, which was established in 1994. Its mission was to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.