Editorial

摘要

Welcome to the first issue of Circuit World Volume 38, which has five papers covering a wide range of subject matter that I hope you will find of interest. The issue begins with a paper from Joe Fjelstad of Verdant Technologies that covers the current state of development of 3D interconnects. The reasons for employing 3D interconnects are both many and varied, but are typically focussed on the need to enhance functionality while shrinking dimensions in order to meet the ever-present demands for better cost and performance in each new generation of products. Interconnection technologies that can truly utilise 3D will play an increasingly important role in the future in enabling these demands to be met. The paper presents details of 3D solutions that have been used over the last 50 years to make interconnections from chip to system and it also includes some details of what may be expected to appear in the future.