机译:用于PCB制造的RDE的多物理场耦合模拟
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, PR China and Department of Physics and Electronic Engineering, Yuncheng University, Yuncheng, PR China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, PR China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd. Shantou, PR China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, PR China;
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, PR China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd. Shantou, PR China;
Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd. Shantou, PR China;
Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd. Shantou, PR China;
Copper electrodeposition; Multiphysics coupling; Printed circuit boards; Rotating disk electrode;
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机译:LImE 1.0简介及其在多物理场仿真耦合代码中的应用。