Mechanical and Electrical Properties of Alloys and Isothermal Section of Ternary Cu-In-Sb System at 673 K

摘要

Lead-free solders with copper represent possible substitution for standard lead-tin solders. For the complete definition of the properties of the ternary Bi-Cu-In system, there were performed the investigation of micro structures, hardness by Brinel, and electric conductivity of the alloys. In the range of this ternary system, numerous alloys were tested for three vertical sections, with molar ratio Sb : Cu = 1, Cu : In = 1, Sb : In = 1. The micro structures of the alloys were investigated by application of optic microscopy. By application of CALPHAD method, and software package PANDAT 8.1. there were calculated the isothermal cross sections at 298 K and 673 K. The experimentally obtained phase compositions in microstructures are in a good agreement with phases on calculated cross sections.