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Characterization of Alloys and Liquidus Projections of Ternary Bi-Sb-Sn system

机译:三元Bi-Sb-Sn系统的合金和液相线投影的表征

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摘要

Given that Sn-based lead-free solders are considered as possible substitution for standard lead-tin solders, properties of the alloys from ternary Bi-Sb-Sn system were characterized by microstructural SEM-EDS analysis, Brinell hardness tests, and electrical conductivity measurements. Isothermal cross section at 298 K and liquidus surface projection were calculated by application of CAL-PHAD method and software package PANDAT 8.1. The experimentally determined phase compositions in analyzed microstructures were found to be in a good agreement with phases on calculated cross sections.
机译:考虑到可以考虑将基于Sn的无铅焊料替代标准的铅-锡焊料,通过微结构SEM-EDS分析,布氏硬度测试和电导率测量来表征三元Bi-Sb-Sn系统合金的性能。应用CAL-PHAD方法和软件包PANDAT 8.1计算了298 K时的等温截面和液相线表面投影。发现在分析的微结构中由实验确定的相组成与计算截面上的相非常吻合。

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