Fabrication and characterization of nanocomposite films Al, Cu/Al and Cr/Al formed on polyimide substrate

摘要

The paper presents data on the application of a coating of Al on a polyimide substrate by the method of dual magnetron sputtering. The possibility of increasing the adhesion strength of Al coatings with polyimide by sputtering an intermediate layer of Cu and Cr is considered. The initial surface of the fabricated Al, Cu/Al and Cr/Al nanocomposite films was studied using electron scanning microscopy, and data on the surface resistance of the films and their adhesion strength with a polyimide substrate are presented. Energy-dispersion analysis showed that the coatings of Al, Cu/Al and Cr/Al nanocomposite films do not contain impurity atoms, which is also confirmed by the results of X-ray phase analysis. It is established that it is possible to obtain stable electrophysical characteristics of the surface with the following thickness of the intermediate layers: Cu - more than 200 nm and Cr - more than 113 nm. The deposition of nanocomposite films on a polyimide substrate reduces its surface resistance by more than 20 orders of magnitude. The adhesive strength of nanocomposite films with a polyimide substrate was studied. The best adhesion strength is provided by a polyimide/Cr/Al sample of 3.1 GPa.