Although Sn-Cu-based flux cored solders are inexpensive, their applications are restricted as they have poor wettability compared with Sn-Ag-Cu-based solders. Senju Metal Industry Co., Ltd. (SMIC) has developed a flux with excellent wettability utilizing the company's specialized organic synthesis technology in order to achieve low price. SMIC has also developed an Sn-Cu-based M24AP alloy (Photo 1) utilizing an alloy composition control technology using additive elements, such as nickel (Ni), germanium (Ge), and phosphorus (P), and commercialized NEO M24AP flux cored solder (Photo 2), thereby solving this problem. At the same time, SMIC has also added to its lineup M24AP alloy for flow solder.
展开▼
机译：尽管基于Sn-Cu的助焊剂价格便宜，但与基于Sn-Ag-Cu的焊料相比，它们的润湿性差，因此其应用受到限制。 Senju Metal Industry Co.，Ltd.（SMIC）利用公司的专业有机合成技术开发了具有优异润湿性的焊剂，以实现低价格。中芯国际还利用合金成分控制技术开发了一种基于Sn-Cu的M24AP合金（照片1），该技术使用添加元素，例如镍（Ni），锗（Ge）和磷（P），以及商业化的NEO M24AP药芯焊料（照片2），从而解决了这个问题。同时，中芯国际还增加了用于流焊的M24AP合金。
展开▼
