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As Smaller SMDs Become Mainstream, Taping Machines Make Room

机译:随着较小的SMD成为主流,编带机将腾出空间

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摘要

In an attempt to increase the sales for portable electronic devices and automotive-related applications, electronic components manufacturers have been redoubling efforts to develop smaller surface mount devices (SMDs) or chip components with higher performance. Components manufacturers aim to meet higher-density mounting in smartphones and tablets and higher reliability in automobiles, which are fields that record high growth. In terms of components mounting technology, surface mount technology (SMT) has already become established for placement of components for smart-phones to automobiles. From components with leads, the electronic components market nowadays is focused more on SMDs. The technological trend points toward smaller SMDs with higher performance, and new product development has been gathering steam to attain this goal.
机译:为了增加便携式电子设备和汽车相关应用的销售额,电子组件制造商一直在加倍努力,以开发更小的表面贴装设备(SMD)或具有更高性能的芯片组件。组件制造商的目标是满足智能手机和平板电脑中更高密度的安装以及汽车中更高的可靠性的要求,而这些领域是高速增长的领域。在组件安装技术方面,已经建立了表面安装技术(SMT),用于将智能手机的组件放置到汽车上。从带引线的组件开始,如今的电子组件市场更加专注于SMD。技术趋势指向具有更高性能的更小的SMD,并且新产品开发一直在加速发展以实现这一目标。

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    《Asia electronics industry》 |2015年第5期|64-65|共2页
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