Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?

摘要

In what follows we determine the mechanical properties of intermetallic phases in microelectronic structures with the help of nanoindentation. Additionally, we try to answer the question of whether nanoindentation can be used to quantify the growth of intermetallic phases, in particular at the interface of a solder connection. Different specimens and treatments (such as reflow processes and subsequent aging) have been analyzed and their influence on mechanical properties will be examined. Finite element (FE) simulations, which are also discussed, will use the results of these experiments as reference values.