...
机译:不同晶体取向下纳米切割单晶钨的地下层研究
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
China Acad Engn Phys Inst Machinery Mfg Technol POB 919-601 Mianyang Sichuan Peoples R China;
Dalian Univ Technol Minist Educ Key Lab Precis & Nontradit Machining Technol Dalian 116024 Peoples R China;
Molecular dynamics; Nano-cutting; Crystal orientation; Single crystal tungsten; Subsurface defect; Dislocation evolution;
机译:单晶铜纳米切削过程中切削参数对表面变形层深度的影响
机译:纳米切割单晶硅刀刃和地下损伤的实验研究
机译:(0.5--0.6)T {sub} m温度范围内钨单晶的蠕变研究:材料特性,研究方法,钨单晶的蠕变
机译:不同表面取向的钨(W)单晶的离子辐照硬化
机译:对单硒化锡和二硫化钨半导体单晶的一些实验研究。
机译:单晶铜纳米切削过程中切削参数对表面变形层深度的影响
机译:单晶铜纳米切削过程中切削参数对表面变形层深度的影响
机译:钨单晶的制备和变形Ⅰ“坯料轧制面和轧制方向对钨单晶板再结晶温度的影响”第Ⅱ部分“钨单晶再结晶”