Comparative Study Of Electroless Copper Deposition Based On The Seed Layers Of Pd, Ptpd And Aupd

摘要

The article reports on electroless deposition of copper films onto p-silicon (100) using different seed (co-seed) layers of Pd, PtPd and AuPd. The dependence of the compositions and morphologies of different seed layers on resultant Cu films were comparatively studied in detail by atomic force microscopy (AFM), field emission scanning electron microscope (FE-SEM) and X-ray photoelectron spectroscopy (XPS). The activities of electroless copper deposition on the p-silicon (100) with different seed (co-seed) layers were evaluated by polarization curve. It is concluded that the bimetallic AuPd seed displayed the highest catalytic activity for electroless copper deposition, and followed by the order of PtPd > Pd.