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Effect of radio frequency power on the inductively coupled plasma etched Al_(0.65)Ga_(0.35)N surface

机译:射频功率对电感耦合等离子体刻蚀Al_(0.65)Ga_(0.35)N表面的影响

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摘要

The etching effects on the surface and electrical characteristics of high Al mole fraction Al_xGa_(1-x) N (x=0.65) have been characterized by X-ray photoelectron spectroscopy (XPS) and transfer length method (TLM) as a function of radio frequency power. XPS results show that the Ga-N and Al-N peaks move to the lower energy after ICP etchings. An increase in the amount of oxygen and a decrease in the amount of nitrogen are observed for the etched samples along with the RF power. The annealing at 450 ℃ is partly effective on removing the oxygen amount which would come from the C-O component and recovering the N deficiencies on the surface of etched sample. The extracted sheet resistance of the AlGaN layer from TLM increases gradually after ICP etching with an increase of RF power. The correlation between the XPS peaks and the electrical properties of the etched samples has been discussed and the annealing effect on the inverse leakage current of the p-i-n AlGaN solar blind UV detector is examined.
机译:通过X射线光电子能谱(XPS)和传输长度方法(TLM)表征了高Al摩尔分数Al_xGa_(1-x)N(x = 0.65)对表面的腐蚀作用和电学特性,其与无线电的函数关系频率功率。 XPS结果表明,ICP蚀刻后,Ga-N和Al-N峰移至较低的能量。对于蚀刻的样品,观察到氧气量的增加和氮气量的减少以及射频功率。在450℃退火对去除C-O成分中的氧含量和恢复蚀刻样品表面的N缺陷具有部分作用。 ICP蚀刻后,随着RF功率的增加,从TLM提取的AlGaN层的薄层电阻逐渐增加。讨论了XPS峰与蚀刻样品的电性能之间的相关性,并研究了退火对p-i-n AlGaN太阳盲UV探测器的反向漏电流的影响。

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  • 来源
    《Applied Surface Science》 |2010年第21期|P.6254-6258|共5页
  • 作者单位

    Microwave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

    rnMicrowave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

    rnMicrowave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

    rnMicrowave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

    rnMicrowave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

    rnBeijing National Laboratory for Condensed Matter Physics, Institute of Physics of Chinese Academy of Sciences, Beijing 100080, China;

    rnMicrowave Devices and Integrated Circuits Department, Institute of Microelectronics of Chinese Academy of Sciences, No. 3, Bei-Tu-Cheng West Road, Beijing 100029, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    AlGaN; ICP etching; XPS; sheet resistance;

    机译:氮化铝镓;ICP蚀刻;XPS;薄层电阻;
  • 入库时间 2022-08-18 03:07:33

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