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Experimental investigation on material migration phenomena in micro-EDM of reaction-bonded silicon carbide

机译:反应结合碳化硅的微EDM中材料迁移现象的实验研究

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摘要

Material migration between tool electrode and workpiece material in micro electrical discharge machining of reaction-bonded silicon carbide was experimentally investigated. The microstructural changes of workpiece and tungsten tool electrode were examined using scanning electron microscopy, cross sectional transmission electron microscopy and energy dispersive X-ray under various voltage, capacitance and carbon nanofibre concentration in the dielectric fluid. Results show that tungsten is deposited intensively inside the discharge-induced craters on the RB-SiC surface as amorphous structure forming micro particles, and on flat surface region as a thin interdiffusion layer of poly-crystalline structure. Deposition of carbon element on tool electrode was detected, indicating possible material migration to the tool electrode from workpiece material, carbon nanofibres and dielectric oil. Material deposition rate was found to be strongly affected by workpiece surface roughness, voltage and capacitance of the electrical discharge circuit. Carbon nanofibre addition in the dielectric at a suitable concentration significantly reduced the material deposition rate.
机译:实验研究了反应结合碳化硅微放电加工中工具电极与工件材料之间的材料迁移。使用扫描电子显微镜,横截面透射电子显微镜和能量色散X射线在介电液中各种电压,电容和碳纳米纤维浓度下检查工件和钨工具电极的微观结构变化。结果表明,钨在放电诱导的弹坑内大量沉积为RB-SiC表面,形成非晶颗粒,形成微粒;而在平坦表面上,则为薄的多晶结构互扩散层。检测到工具电极上的碳元素沉积,表明材料可能从工件材料,碳纳米纤维和介电油迁移到工具电极。发现材料沉积速率受工件表面粗糙度,放电电路的电压和电容的强烈影响。以适当的浓度在电介质中添加碳纳米纤维会大大降低材料的沉积速率。

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