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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >MOD Buffer/YBCO Approach to Fabricate Low-Cost Second Generation HTS Wires
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MOD Buffer/YBCO Approach to Fabricate Low-Cost Second Generation HTS Wires

机译:MOD Buffer / YBCO方法制造低成本的第二代HTS导线

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The metal organic deposition (MOD) of buffer layers on RABiTS substrates is considered a potential, low-cost approach to manufacturing high performance Second Generation (2G) high temperature superconducting (HTS) wires. The typical architecture used by American Superconductor in their 2G HTS wire consists of a Ni-W (5 at.%) substrate with a reactively sputtered ${rm Y}_{2}{rm O}_{3}$ seed layer, YSZ barrier layer and a ${rm CeO}_{2}$ cap layer. This architecture supports critical currents of over 300 A/cm-width (77 K, self-field) with 0.8 $mu{rm m}$ YBCO films deposited by the TFA-MOD process. The main challenge in the development of the MOD buffers is to match or exceed the performance of the standard vacuum deposited buffer architecture. We have recently shown that the texture and properties of ${rm MOD-La}_{2}{rm Zr}_{2}{rm O}_{7}$ (LZO) barrier layers can be improved by inserting a thin sputtered ${rm Y}_{2}{rm O}_{3}$ seed layer and prepared MOD deposited LZO layers followed by MOD or RF sputtered ${rm CeO}_{2}$ cap layers that support MOD-YBCO films with ${rm I}_{rm c}$''s of 200 and 255 A/cm-width, respectively. Detailed X-ray and microstructural characterizations indicated that ${rm MOD-CeO}_{2}$ cap reacted completely with MOD YBCO to form ${rm BaCeO}_{3}$. However, sputtered ${rm CeO}_{2}$ cap/MOD YBCO interface remains clean. By further optimizing the coating conditions and reducing the heat-treatment temperatures, we have dem-onstrated an ${rm I}_{rm c}$ of 336 A/cm with improved LZO layers and sputtered ${rm CeO}_{2}$ cap and exceeded the performance of that of standard vacuum deposited buffers.
机译:RABiTS基板上的缓冲层的金属有机沉积(MOD)被认为是制造高性能第二代(2G)高温超导(HTS)导线的一种潜在的低成本方法。美国超导体在其2G HTS导线中使用的典型体系结构由Ni-W(5%at。%)衬底和反应溅射的$ {rm Y} _ {2} {rm O} _ {3} $种子层组成, YSZ阻挡层和$ {rm CeO} _ {2} $覆盖层。该架构支持通过TFA-MOD工艺沉积的0.8 µm {rm m} $ YBCO薄膜来支持超过300 A / cm宽度的临界电流(77 K,自电场)。 MOD缓冲区开发中的主要挑战是匹配或超过标准真空沉积缓冲区体系结构的性能。我们最近发现,通过插入薄的$ {rm MOD-La} _ {2} {rm Zr} _ {2} {rm O} _ {7} $(LZO)势垒层,可以改善其织构和特性溅射$ {rm Y} _ {2} {rm O} _ {3} $种子层,并准备MOD沉积的LZO层,然后进行MOD或RF溅射支持MOD-YBCO的$ {rm CeO} _ {2} $帽层$ {rm I} _ {rm c} $分别为200和255 A / cm宽的胶片。详细的X射线和微观结构表征表明,$ {rm MOD-CeO} _ {2} $帽与MOD YBCO完全反应形成$ {rm BaCeO} _ {3} $。但是,溅射的$ {rm CeO} _ {2} $ cap / MOD YBCO接口仍然干净。通过进一步优化涂层条件并降低热处理温度,我们证明了336 A / cm的$ {rm I} _ {rm c} $具有改进的LZO层并溅射了$ {rm CeO} _ {2 } $上限,并超过了标准真空沉积缓冲区的性能。

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