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Shadowgraphic imaging of material removal during laser drilling with a long pulse excimer laser

机译:用长脉冲准分子激光在钻孔过程中去除材料的阴影成像

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After the development of a novel XeCl excimer laser with a nearly diffraction-limited beam and 175 ns pulse length, research was done on different industrial applications of this laser. Hole drilling, one of these applications, was studied extensively. A better understanding of the drilling process is necessary to optimise the drilling efficiency and to control the quality of the holes. A shadowgraphic imaging technique was used for studying the removal of material from the hole and the absorption of the laser beam by this removed material. Images were made at successive times both during and after the laser pulse. In drilling of thin foils, it was shown that the material was ejected mainly after the laser pulse. A comparison of different materials showed that the drilling process should be optimised for each material independently. Furthermore, the plume was found to be not fully transparent for processing materials with a strong absorption line at or near the laser wavelength. The correlation between material and drilling speed suggests improved energy transfer and improved melt ejection for the materials with this absorption.
机译:在开发出具有近衍射极限光束和175 ns脉冲长度的新型XeCl准分子激光器之后,对该激光器的不同工业应用进行了研究。钻孔是这些应用之一,已经得到了广泛的研究。必须对钻孔过程有更好的了解,以优化钻孔效率并控制孔的质量。阴影成像技术被用于研究从孔中去除材料以及该去除的材料对激光束的吸收。在激光脉冲期间和之后的连续时间成像。在薄箔的钻孔中,显示出该材料主要是在激光脉冲之后喷射的。对不同材料的比较表明,应针对每种材料分别优化钻孔过程。此外,发现羽流对于在激光波长处或附近具有强吸收线的加工材料不是完全透明的。材料与钻孔速度之间的相关性表明,具有这种吸收能力的材料可以改善能量传递并改善熔体喷射。

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