首页> 外文期刊>Applied Physics Letters >Understanding the grain-growth mechanism of high-performance organic semiconducting diphenyl-dibenzothiopheno[6,5-b:6',5'-f]thieno[3,2-b] thiophene molecules
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Understanding the grain-growth mechanism of high-performance organic semiconducting diphenyl-dibenzothiopheno[6,5-b:6',5'-f]thieno[3,2-b] thiophene molecules

机译:了解高性能有机半导体二苯基-二苯并噻吩[6,5-b:6',5'-f]噻吩并[3,2-b]噻吩分子的晶粒长大机理

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摘要

We report here our investigation on the grain-growth mechanism of diphenyl-dibenzothiopheno[6,5-b:6',5'-f]thieno[3,2-b]thiophene (DPh-DBTTT), which was recently published as a high-performance organic semiconductor. Atomic force microscopy revealed that unconventional needle-like structures grew on the surface of DPh-DBTTT thin films, and these structures became more dominant as the film thickness increased and the deposited film's surface temperature decreased. In combination with the crystal structure simulations, the grazing-incidence wide-angle x-ray scattering data indicated that the DPh-DBTTT molecules preferred an edge-on orientation near the interface between the substrate and DPh-DBTTT thin film, while the needle-like structures consisted of a face-on arrangement of the molecules. We suggest that this structural change originates from the large step-edge energy barrier of the DPh-DBTTT molecules. Our findings would be highly valuable to the design of new high-performance organic semiconducting materials and optimization of the conditions of thin-film deposition.
机译:我们在此报告对二苯基-二苯并噻吩[6,5-b:6',5'-f]噻吩并[3,2-b]噻吩(DPh-DBTTT)的晶粒长大机理的研究,该出版物最近发表为高性能有机半导体。原子力显微镜显示,DPh-DBTTT薄膜的表面形成了非常规的针状结构,并且随着膜厚度的增加和沉积膜表面温度的降低,这些结构变得更加占优势。结合晶体结构模拟,掠入射广角X射线散射数据表明,DPh-DBTTT分子在基材与DPh-DBTTT薄膜之间的界面附近倾向于边沿取向,而针头类似的结构由分子的正面排列组成。我们建议这种结构变化源自DPh-DBTTT分子的较大的台阶边缘能垒。我们的发现对于新型高性能有机半导体材料的设计以及薄膜沉积条件的优化具有非常重要的价值。

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  • 来源
    《Applied Physics Letters》 |2017年第23期|233301.1-233301.5|共5页
  • 作者单位

    Platform Technology Lab, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Platform Technology Lab, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Platform Technology Lab, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

    Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics Co., Ltd., 130 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do 16678, South Korea;

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  • 正文语种 eng
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  • 入库时间 2022-08-18 03:14:24

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