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Development of simple high-resolution embedded printing for transparent metal grid conductors

机译:开发用于透明金属栅格导体的简单高分辨率嵌入式印刷

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摘要

We developed a simple embedded printing method that is capable of forming high-resolution patterns for transparent metal grid conductors. The simple printing method involves embedding conductive ink in a groove structure formed by nanoimprinting. Since this printing utilizes capillary force, conductive ink easily fills groove structures with small widths of several microns to the submicron scale. An embedded pattern with a line width of 300 nm was printed. In addition, a high aspect ratio of 3.1 was achieved with a 1.6 μm embedded pattern. A prototype transparent conductive film was developed with excellent optical and electrical performances: a high transmittance of 82.7% and a low sheet resistance of 5.1 Ω/sq at a grid width of 3.0 μm and a grid pitch of 150 μm. The grid parameters can easily be changed by mold design during the nanoimprint process. The transparent conductive film (TCF) showed excellent bending resistance compared with indium tin oxide.
机译:我们开发了一种简单的嵌入式印刷方法,该方法能够为透明金属栅格导体形成高分辨率图案。简单的印刷方法包括将导电墨水嵌入通过纳米压印形成的凹槽结构中。由于这种印刷利用毛细作用力,导电油墨很容易填充沟槽结构,其宽度小至几微米到亚微米级。印刷具有300nm的线宽的嵌入图案。此外,使用1.6μm的嵌入式图案可实现3.1的高长宽比。开发出具有优异的光学和电气性能的原型透明导电膜:在3.0微米的栅距和150微米的栅距下,透光率高达82.7%,薄层电阻为5.1Ω/ sq。在纳米压印过程中,可以通过模具设计轻松更改网格参数。与氧化铟锡相比,透明导电膜(TCF)表现出优异的抗弯曲性。

著录项

  • 来源
    《Applied Physics Letters》 |2017年第6期|063107.1-063107.4|共4页
  • 作者单位

    Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan;

    Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan;

    Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan;

    Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-18 03:14:13

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