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Room temperature and high temperature sealing properties and compression properties of compressive gaskets made of micrometric vermiculite particles

机译:微米级ver石颗粒制成的压缩垫片的室温和高温密封性能及压缩性能

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摘要

Vermiculite gaskets obtained by pressing vermiculite powders in the range of 17.7-80 MPa, were studied for their sealing (leak rate measurements) and compressive properties (compressibility and resiliency). The in plane permeability at room temperature was found to decrease strongly through increasing elaboration pressure, that reduced both the median pore radius (<30 nm) and the macropore volume fraction (<45%), measured by mercury intrusion. After annealing at temperatures of up to 600 degrees C, the out of plane permeability (measured at room temperature) was increasing from similar to 10(-20) (at 200 degrees C) to similar to 10(-24) due to the increase in anisotropy related to the densification and the formation of interlayer bonds. The global leak rate was found to be determined exclusively by the contact leak rate and independent of the material's permeability. The leak rates measured at room temperature were also found to be dependent on the gasket's resiliency values. The global helium leak rate (2.5 x 10(-2) atm.cm(3).s(-1).m(-1), for 35 MPa working pressure, under 5 bar helium pressure) was relied neither on the working temperature (25 degrees C to 800 degrees C) nor the material porosity for gaskets pressed at 200 degrees C and 80 MPa. The resiliency (similar to 5%) and compressibility (9%) values of these gaskets were reduced, as heating the materials to 800 degrees C due to the densification induced by both pressure and temperature, increasing their rigidity. (C) 2015 Elsevier B.V. All rights reserved.
机译:研究了通过在17.7-80 MPa范围内压制ver石粉而获得的mic石垫片的密封性(泄漏率测量)和压缩特性(可压缩性和弹性)。发现在室温下,平面内磁导率会通过增加精化压力而大大降低,从而降低了中位数孔半径(<30 nm)和大孔体积分数(<45%)(通过压汞法测得)。在最高600摄氏度的温度下退火后,由于增加,面外磁导率(在室温下测量)从近似10(-20)(在200摄氏度)增加到近似10(-24)。各向异性与致密化和层间键的形成有关。发现整体泄漏率完全由接触泄漏率决定,与材料的渗透性无关。还发现在室温下测得的泄漏率取决于垫圈的弹性值。总体氦泄漏率(2.5 x 10(-2)atm.cm(3).s(-1).m(-1),在35 MPa工作压力下,在5 bar氦压力下)都不依赖于工作温度(25摄氏度至800摄氏度)或在200摄氏度和80 MPa下压制的垫片的材料孔隙率。由于由于压力和温度引起的致密化将材料加热到800摄氏度,这些垫片的回弹性(约5%)和可压缩性(9%)值降低了,从而提高了其刚性。 (C)2015 Elsevier B.V.保留所有权利。

著录项

  • 来源
    《Applied clay science》 |2015年第9期|1-8|共8页
  • 作者单位

    Univ Savoie Mt Blanc, LCME, F-73000 Chambery, France|CEA DEN DTEC Lab Maestral, F-30207 Bagnols Sur Ceze, France;

    CEA DEN DTEC Lab Maestral, F-30207 Bagnols Sur Ceze, France;

    Univ Savoie Mt Blanc, LCME, F-73000 Chambery, France;

    Univ Savoie Mt Blanc, LCME, F-73000 Chambery, France;

    CEA DEN DTEC Lab Maestral, F-30207 Bagnols Sur Ceze, France;

    CEA DEN DTEC Lab Maestral, F-30207 Bagnols Sur Ceze, France|Technet Grp France, F-42029 St Etienne, France;

    CEA DEN DTEC Lab Maestral, F-30207 Bagnols Sur Ceze, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Vermiculite; Permeability; Leak rate; Sealing; High temperature; Resiliency;

    机译:石;渗透性;泄漏率;密封;高温;弹性;

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