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Automation and Advanced Packaging Assembly

机译:自动化和高级包装组装

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摘要

Automation of microelectronic assembly processes, especially as these become more precise and complex, provide manufacturers one of the best tools to gain competitive leverage. Automation can improve throughput, increase quality (consistency), and improve yield. Automation → Consistency → Improved Quality → Higher Yield → Lower costs → Scalability Requirements for smaller, more complex parts in many cases render the manual assembly process obsolete. Typically, significant material and process changes and a high degree of operator training need to take place to accommodate automation. Process engineers not schooled in automated processes need to become conversant with the precise demands of implementing a mechanized microlectronic assembly process. Automated microelectronic assembly equipment is complex and requires highly skilled operators and maintenance personnel who understand both process and equipment. Suppliers should have a support infrastructure capable of maintaining 24/7 operations worldwide.
机译:微电子装配过程的自动化,尤其是随着它们变得越来越精确和复杂,为制造商提供了获得竞争优势的最佳工具之一。自动化可以提高吞吐量,提高质量(一致性)并提高产量。自动化→一致性→提高质量→提高产量→降低成本→可伸缩性在许多情况下,对更小,更复杂的零件的要求使手工装配过程过时了。通常,需要进行重大的材料和过程更改以及高度的操作员培训以适应自动化。没有接受过自动化过程培训的过程工程师需要精通实现机械化微电子组装过程的精确要求。自动化的微电子组装设备非常复杂,需要了解过程和设备的高技能操作员和维护人员。供应商应拥有能够在全球范围内维持24/7运营的支持基础架构。

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