Fan-in package-on-package (FiPoP) accommodates multiple die and larger die sizes in a reduced footprint. Multiple logic, analog, and memorydie can be stacked in the bottom PoP package. Smaller, conventional memory packages with center ball grid ar-ray(BGA) patterns can be stacked on top, due to an exposed array of land pads on the top, center surface of the package. The design provides a more stable base that improves final assembly yields by eliminating warpage in the bottom package.
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