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Solution-Processed Full-Color Polymer Organic Light-Emitting Diode Displays Fabricated by Direct Photolithography

机译:通过直接光刻技术制备的固溶处理全色聚合物有机发光二极管显示器

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The first full-color polymer organic light-emitting diode (OLED) display is reported, fabricated by a direct photolithography process, that is, a process that allows direct structuring of the electroluminescent layer of the OLED by exposure to UV light. The required photosensitivity is introduced by attaching oxetane side groups to the backbone of red-, green-, and blue-light-emjtting polymers. This allows for the use of photolithography to selectively crosslink thin films of these polymers. Hence the solution-based process requires neither an additional etching step, as is the case for conventional photoresist lithography, nor does it rely on the use of prestructured substrates, which are required if ink-jet printing is used to pixilate the emissive layer. The process allows for low-cost display fabrication without sacrificing resolution: Structures with features in the range of 2 μm are obtained by patterning the emitting polymers via UV illumination through an ultrafine shadow mask. Compared to state-of-the-art fluorescent OLEDs, the display prototype (pixel size 200 μm × 600 μm) presented here shows very good efficiency as well as good color saturation for all three colors. The application in solid-state lighting is also possible: Pure white light [Commision Internationale de l'Eclairage (CIE) values of 0.33, 0.33 and color rendering index (CRI) of 76] is obtained at an efficiency of 5 cd A~(-1) by mixing the three colors in the appropriate ratio. For further enhancement of the device efficiency, an additional hole-transport layer (HTL), which is also photo-crosslinkable and therefore suitable to fabricate multilayer devices from solution, is embedded between the anode and the electroluminescent layer.
机译:据报道,第一全色聚合物有机发光二极管(OLED)显示器是通过直接光刻工艺制造的,即,该工艺允许通过暴露于紫外光来直接构造OLED的电致发光层。通过将氧杂环丁烷侧基连接到发红光,发绿光和发蓝光的聚合物的骨架上,可以引入所需的光敏性。这允许使用光刻来选择性地交联这些聚合物的薄膜。因此,基于溶液的工艺既不需要像常规光刻胶平版印刷那样需要额外的蚀刻步骤,也不依赖于使用预先构造的基板,如果使用喷墨印刷来使发射层像素化,则需要使用预先构造的基板。该工艺可在不牺牲分辨率的情况下实现低成本的显示器制造:通过在超细阴影掩模上通过UV照射对发光聚合物进行构图,可获得结构在2μm范围内的结构。与最先进的荧光OLED相比,此处展示的显示原型(像素尺寸200μm×600μm)显示出非常好的效率以及所有三种颜色的良好色饱和度。在固态照明中的应用也是可能的:以5 cd A〜()的效率获得纯白光[国际照明标准(CIE)值为0.33、0.33和显色指数(CRI)为76]。 -1)以适当的比例混合三种颜色。为了进一步提高器件效率,在阳极和电致发光层之间嵌入了另外的空穴传输层(HTL),该空穴传输层也是可光交联的,因此适用于由溶液制造多层器件。

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