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首页> 外文期刊>Advanced Functional Materials >Ultrathin Sticker-Type ZnO Thin Film Transistors Formed by Transfer Printing via Topological Confinement of Water-Soluble Sacrificial Polymer in Dimple Structure
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Ultrathin Sticker-Type ZnO Thin Film Transistors Formed by Transfer Printing via Topological Confinement of Water-Soluble Sacrificial Polymer in Dimple Structure

机译:通过凹痕结构中水溶性牺牲聚合物的拓扑限制转移印刷形成的超薄贴纸型ZnO薄膜晶体管

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摘要

To create ultrathin sticker-type electronic devices that can be attached to unconventional substrates, it is highly desirable to develop printable membrane-type electronics on a handling substrate and then transfer the printing to a target surface. A facile method is presented for high-efficiency transfer printing by controlling the interfacial adhesion between a handling substrate and an ultrathin substrate in a systematic manner under mild conditions. A water-soluble sacrificial polymer layer is employed on a dimpled handling substrate, which enables the topological confinement of the polymer residue inside and near the dimples during the etching and drying processes to reduce the interfacial adhesion gently, creating a high yield of transfer printing in a deterministic manner. As an example of an electronic device that was created using this method, a highly flexible sticker-type ZnO thin film transistor was successfully developed with a thickness of 13 μm including a printable ultrathin substrate, which can be attached to various substrates, such as paper, plastic, and stickers.
机译:为了制造可以附着到非常规基板上的超薄贴纸型电子设备,非常需要在处理基板上开发可印刷膜型电子设备,然后将印刷转移到目标表面。提出了一种通过在温和条件下系统地控制处理基材和超薄基材之间的界面粘附力来实现高效转印的简便方法。在有凹痕的处理基板上使用水溶性牺牲聚合物层,可在蚀刻和干燥过程中对凹痕内部和附近的聚合物残留物进行拓扑限制,从而缓和降低界面附着力,从而在转移印刷中获得高产量确定性的方式。作为使用该方法制作的电子设备的一个示例,成功开发出了高度柔性的粘贴型ZnO薄膜晶体管,其厚度为13μm,其中包括可印刷的超薄基板,该基板可粘贴到各种基板上,例如纸,塑料和贴纸。

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  • 来源
    《Advanced Functional Materials》 |2013年第11期|1375-1382|共8页
  • 作者单位

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

    School of Materials Science and Engineering Gwangju Institute of Science and Technology (GIST) 1 Oryong-Dong, Buk-Gu, Gwangju 500-712, Korea;

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