...
首页> 外文期刊>Advanced Functional Materials >Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings
【24h】

Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

机译:使用非晶碳化硅涂层定制高纵横比碳纳米管阵列的机械性能

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-litho-graphically defined CNT pillars that are confbrmally coated with amorphous silicon carbide (a-SiC) to strengthen the interlocking of individual CNTs at junctions using low pressure chemical vapor deposition (LPCVD). We further quantify the mechanical response by performing flat-punch nanoindenta-tion measurements on coated CNT pillars with various high-aspect-ratios. We discovered new mechanical failure modes of coated CNT pillars, such as "bamboo" and brittle-like composite rupture as coating thickness increases. Furthermore, a significant increase in strength and modulus is achieved. For CNT pillars with high aspect ratio (1:10) and coating thickness of 21.4 nm, the compressive strength increases by an order of magnitude of 3, towards 1.8 GPa (from below 1 MPa for uncoated CNT pillars) and the elastic modulus increases towards 125 GPa. These results show that our coated CNT pillars, which can serve as vertical interconnects and 3D super-capacitors, can be transformed into robust high-aspect-ratio 3D-micro architectures with semiconductor device compatible processes.
机译:碳纳米管(CNT)阵列的多孔性质允许通过渗透和沉积纳米级保形涂层来调整其机械响应的独特机会。在这里,我们制作了新颖的光刻定义的CNT柱,这些柱共用无定形碳化硅(a-SiC)进行了涂层,以使用低压化学气相沉积(LPCVD)增强结点处各个CNT的互锁。我们通过在具有各种高纵横比的涂层CNT柱上进行平冲纳米感度测量来进一步量化机械响应。我们发现随着涂层厚度的增加,涂层的CNT柱会出现新的机械失效模式,例如“竹子”和类似脆性的复合材料破裂。此外,强度和模量显着增加。对于高纵横比(1:10),涂层厚度为21.4 nm的CNT柱,抗压强度增加3个数量级,达到1.8 GPa(对于未涂层的CNT柱,抗压强度低于1 MPa),而弹性模量则朝125 GPa。这些结果表明,我们的涂层CNT柱可用作垂直互连和3D超级电容器,可通过与半导体器件兼容的工艺转换为坚固的高纵横比3D-微体系结构。

著录项

  • 来源
    《Advanced Functional Materials》 |2014年第36期|5737-5744|共8页
  • 作者单位

    Department of Microelectronics Delft University of Technology Feldmannweg 17 2628CT, Delft, The Netherlands;

    Department of Microelectronics Delft University of Technology Feldmannweg 17 2628CT, Delft, The Netherlands;

    Department of Microelectronics Delft University of Technology Feldmannweg 17 2628CT, Delft, The Netherlands;

    Department of Structural Engineering Delft University of Technology Stevinweg 1 2628CN, Delft, The Netherlands;

    Department of Microelectronics Delft University of Technology Feldmannweg 17 2628CT, Delft, The Netherlands;

    Department of Mechanical Engineering Lamar University Beaumont, TX 77710, USA;

    Department of Microelectronics Delft University of Technology Feldmannweg 17 2628CT, Delft, The Netherlands;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号