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首页> 外文期刊>Advanced Functional Materials >Mg_(3+δ)sb_xBi_(2-x) Family: A Promising Substitute for the State-of-the-Art n-Type Thermoelectric Materials near Room Temperature
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Mg_(3+δ)sb_xBi_(2-x) Family: A Promising Substitute for the State-of-the-Art n-Type Thermoelectric Materials near Room Temperature

机译:Mg_(3 +δ)sb_xBi_(2-x)族:接近室温的最新n型热电材料的理想替代品

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摘要

The Bi2Te3-xSex family has constituted n-type state-of-the-art thermoelectric materials near room temperature (RT) for more than half a century, which dominates the active cooling and novel heat harvesting application near RT. However, the drawbacks of a brittle nature and Te-content restricts the possibility for exploring potential applications. Here, it is shown that the Mg3+delta SbxBi2-x family ((ZT)(avg) = 1.05) could be a promising substitute for the Bi2Te3-xSex family ((ZT)(avg) = 0.9-1.0) in the temperature range of 50-250 degrees C based on the comparable thermoelectric performance through a synergistic effect from the tunable bandgap using the alloy effect and the suppressible Mg-vacancy formation using an interstitial Mn dopant. The former is to shift the optimal thermoelectric performance to near RT, and the latter is helpful to partially decouple the electrical transport and thermal transport in order to get an optimal RT power factor. The positive temperature dependence of the bandgap suggests this family is also a superior medium-temperature thermoelectric material for the significantly suppressed bipolar effect. Furthermore, a two times higher mechanical toughness, compared with the Bi2Te3-xSex family, allows for a promising substitute for state-of-the-art n-type thermoelectric materials near RT.
机译:Bi2Te3-xSex系列已经在室温(RT)附近构成n型最先进的热电材料,占据了RT附近的主动冷却和新型集热应用领域。然而,脆性和Te含量的缺点限制了探索潜在应用的可能性。在此表明,在温度范围内,Mg3 +δSbxBi2-x家族((ZT)(avg)= 1.05)可以替代Bi2Te3-xSex家族((ZT)(avg)= 0.9-1.0)。根据可比的热电性能,通过使用合金效应的可调节带隙产生的协同效应,以及使用间隙性Mn掺杂剂产生的可抑制的Mg空穴形成,可在50-250摄氏度的温度范围内进行调节。前者是将最佳热电性能移至接近室温,后者有助于将电传输和热传输部分解耦,以获得最佳的RT功率因数。带隙对温度的正相关性表明,该族也是显着抑制双极性效应的优良中温热电材料。此外,与Bi2Te3-xSex系列产品相比,其机械韧性高出两倍,可以替代RT上最先进的n型热电材料。

著录项

  • 来源
    《Advanced Functional Materials》 |2019年第4期|1807235.1-1807235.10|共10页
  • 作者单位

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China|AECC, Beijing Inst Aeronaut Mat, Beijing, Peoples R China;

    Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China|Shenzhen Univ, Coll Phys & Energy, Shenzhen Key Lab Adv Thin Films & Applicat, Shenzhen 518060, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

    Chinese Acad Sci, Inst High Energy Phys, Beijing Synchrotron Radiat Facil, Beijing 100049, Peoples R China;

    Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai Synchrotron Radiat Facil, Shanghai 201204, Peoples R China;

    Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Phys, Shenzhen 518055, Peoples R China;

    Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    band engineering; fracture toughness; Mg3+delta SbxBi2-x; room temperature; thermoelectric materials;

    机译:带工程;断裂韧性;Mg3 +δSbxBi2-x;室温;热电材料;

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