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Indentation Behavior and Mechanical Properties of Tungsten/Chromium co-Doped Bismuth Titanate Ceramics Sintered at Different Temperatures

机译:钨/铬共掺杂钛酸铋铋酸盐陶瓷在不同温度下的压痕行为和力学性能

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摘要

A sort of tungsten/chromium(W/Cr) co-doped bismuth titanate (BIT) ceramics (Bi4Ti2.95W0.05O12.05 + 0.2 wt % Cr2O3, abbreviate to BTWC) are ordinarily sintered between 1050 and 1150 °C, and the indentation behavior and mechanical properties of ceramics sintered at different temperatures have been investigated by both nanoindentation and microindentation technology. Firstly, more or less Bi2Ti2O7 grains as the second phase were found in BTWC ceramics, and the grain size of ceramics increased with increase of sintering temperatures. A nanoindentation test for BTWC ceramics reveals that the testing hardness of ceramics decreased with increase of sintering temperatures, which could be explained by the Hall–Petch equation, and the true hardness could be calculated according to the pressure-state-response (PSR) model considering the indentation size effect, where the value of hardness depends on the magnitude of load. While, under the application of microsized Vickers, the sample sintered at a lower temperature (1050 °C) gained four linearly propagating cracks, however, they were observed to shorten in the sample sintered at a higher temperature (1125 °C). Moreover, both the crack deflection and the crack branching existed in the latter. The hardness and the fracture toughness of BTWC ceramics presented a contrary variational tendency with increase of sintering temperatures. A high sintering tends to get a lower hardness and a higher fracture toughness, which could be attributed to the easier plastic deformation and the stronger crack inhibition of coarse grains, respectively, as well as the toughening effect coming from the second phase.
机译:通常在1050至1150°C之间烧结一种钨/铬(W / Cr)共掺杂钛酸铋(BIT)陶瓷(Bi4Ti2.95W0.05O12.05 + 0.2 wt%Cr2O3,缩写为BTWC),通过纳米压痕和微压痕技术研究了在不同温度下烧结的陶瓷的压痕行为和力学性能。首先,在BTWC陶瓷中发现了或多或少的Bi 2 Ti 2 O 7晶粒作为第二相,并且随着烧结温度的升高,陶瓷的晶粒尺寸增大。 BTWC陶瓷的纳米压痕测试表明,陶瓷的测试硬度随烧结温度的升高而降低,这可以用Hall-Petch方程解释,并且可以根据压力状态响应(PSR)模型计算出真实的硬度考虑压痕尺寸效应,其中硬度值取决于载荷的大小。虽然在微米级维氏硬度的应用下,在较低温度(1050°C)下烧结的样品出现了四个线性扩展的裂纹,但是,在较高温度(1125°C)下烧结的样品中观察到它们缩短了。而且,在后者中同时存在裂纹偏转和裂纹分支。随着烧结温度的升高,BTWC陶瓷的硬度和断裂韧性呈现出相反的变化趋势。较高的烧结趋向于获得较低的硬度和较高的断裂韧性,这可以分别归因于较容易的塑性变形和对粗晶粒的较强的裂纹抑制,以及归因于第二相的增韧效果。

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