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Decreasing Resistivity of Silicon Carbide Ceramics by Incorporation of Graphene

机译:通过掺入石墨烯来降低碳化硅陶瓷的电阻率

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摘要

Silicon carbide (SiC) ceramic is an ideal material for mechanical seal because of its super hardness, high strength, low friction coefficient, good thermal conductivity, and resistance to friction and wear. However, due to relatively high resistivity of SiC ceramic, the triboelectric charge caused by rubbing of mechanical seal end-faces could not be released. It is terrible that the accumulation of triboelectric charge could cause electrochemical corrosion, which would accelerate wear. To decrease the resistivity of SiC ceramic is a desire for improving the performance of mechanical seal. In this research, decreasing resistivity of pressureless sintered SiC ceramic was investigated by conductive pathways through semiconductive grains in a body by incorporation of graphene, which has an extremely low resistivity. With the increasing of graphene from 0 to 2 wt.%, the volume resistivity of SiC ceramics sintered with graphene decreased logarithmically from >106 to around 200 Ω·cm, and the bulk density decreased gradually, from 3.132 to 3.039 g/cm3. In order to meet the requirements of mechanical seal, SiC ceramic sintered with 1 wt.% of graphene, for which the volume resistivity is of 397 Ω·cm, the bulk density is of 3.076 g/cm3, and the flexural strength is of 364 MPa, was optimized when all properties were taken into consideration. It is possible to fabricate low-resistivity SiC ceramic as a useful friction pair material for mechanical seal in a special condition, without excessive loss of their excellent mechanical properties by the introduction of partially connected graphene as conductive pathway into semiconducting ceramic.
机译:碳化硅(SiC)陶瓷是机械密封的理想材料,因为其超硬,强度高,摩擦系数低,导热系数良好,以及耐摩擦和磨损的抵抗力。然而,由于SiC陶瓷的相对高的电阻率,不能释放由机械密封端面摩擦引起的摩擦电荷。摩擦电荷的积累可能会导致电化学腐蚀,这将是可怕的,这将加速磨损。为了降低SiC陶瓷的电阻率是提高机械密封的性能的需求。在该研究中,通过通过掺入石墨烯来研究通过体内半导体颗粒的导电途径对无气烧结SiC陶瓷的电阻率降低,其具有极低的电阻率。随着0至2重量%的石墨烯的增加。烧结用石墨烯的SiC陶瓷的体积电阻率从> 106到约200Ω·cm,堆积密度从3.132逐渐降低到3.039g / cm3。为了满足机械密封的要求,用1重量%的石墨烯烧结的SiC陶瓷,体积电阻率为397Ω·cm,堆积密度为3.076g / cm 3,弯曲强度为364当考虑所有性质时,MPA经过优化。可以在特殊条件下制造用于机械密封的有用的摩擦对材料的低电阻率SiC陶瓷,而不通过将部分连接的石墨烯作为导电通路引入半导体陶瓷来过度丧失它们的优异机械性能。

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