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Imaging Conductivity Changes in Monolayer Graphene Using Electrical Impedance Tomography

机译:使用电阻断层扫描的Monolayer Graphene的成像电导率变化

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摘要

Recently, graphene has gained a lot of attention in the electronic industry due to its unique properties and has paved the way for realizing novel devices in the field of electronics. For the development of new device applications, it is necessary to grow large wafer-sized monolayer graphene samples. Among the methods to synthesize large graphene films, chemical vapor deposition (CVD) is one of the promising and common techniques. However, during the growth and transfer of the CVD graphene monolayer, defects such as wrinkles, cracks, and holes appear on the graphene surface. These defects can influence the electrical properties and it is of interest to know the quality of graphene samples non-destructively. Electrical impedance tomography (EIT) can be applied as an alternate method to determine conductivity distribution non-destructively. The EIT inverse problem of reconstructing conductivity is highly non-linear and is heavily dependent on measurement accuracy and modeling errors related to an accurate knowledge of electrode location, contact resistances, the exact outer boundary of the graphene wafer, etc. In practical situations, it is difficult to eliminate these modeling errors as complete knowledge of the electrode contact impedance and outer domain boundary is not fully available, and this leads to an undesirable solution. In this paper, a difference imaging approach is proposed to estimate the conductivity change of graphene with respect to the reference distribution from the data sets collected before and after the change. The estimated conductivity change can be used to locate the defects on the graphene surface caused due to the CVD transfer process or environment interaction. Numerical and experimental results with graphene sample of size 2.5 × 2.5 cm are performed to determine the change in conductivity distribution and the results show that the proposed difference imaging approach handles the modeling errors and estimates the conductivity distribution with good accuracy.
机译:最近,由于其独特的特性,石墨烯在电子行业中取得了很多关注,并且为实现了电子产品领域的新设备铺平了道路。为了开发新的设备应用,有必要种植大晶片大小的单层石墨烯样品。在合成大型石墨烯薄膜的方法中,化学气相沉积(CVD)是有前途和常用技术之一。然而,在CVD石墨烯单层的生长和转移期间,石墨烯表面上出现皱纹,裂缝和孔等缺陷。这些缺陷可以影响电性能,并且有意思是不破坏性地了解石墨烯样品的质量。电阻抗断层扫描(EIT)可以作为替代方法应用,以确定导电性分布。重建导电性的EIT逆问题是高度非线性的,并且严重依赖于与电极位置,接触电阻,石墨烯晶片的精确外边界等的准确了解相关的测量精度和建模误差。它难以消除这些建模误差,因为电极接触阻抗和外部域边界不完全可用,这导致不希望的解决方案。在本文中,提出了一种差异成像方法来估计石墨烯相对于从在变化之前和之后收集的数据集的参考分布的电导率变化。估计的电导率变化可用于定位由于CVD转移过程或环境相互作用引起的石墨烯表面上的缺陷。进行数值和实验结果,具有大小2.5×2.5cm的石墨烯样品以确定导电性分布的变化,结果表明,所提出的差异成像方法处理建模误差并估计电导率分布良好的准确性。

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