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Quantifying Charge Effects on Fouling Layer Strength and (Ir)Removability during Cross-Flow Microfiltration

机译:在交叉流动微滤期间量化对Fougling层强度和(IR)可去除性的电荷效应

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摘要

Fouling of membranes is still an important limiting factor in the application of membrane technology. Therefore, there is still a need for an in-depth understanding of which parameters affect the (ir)removability of fouling layers, as well as the mechanisms behind fouling. In this study, fluid dynamic gauging (FDG) was used to investigate the influence of charge effects between negatively charged foulant particles and cations on cake cohesive strength. Fouling cakes’ thicknesses and cohesive strengths were estimated during membrane operations, where microfiltration (MF) membranes were fouled in a feed-and-bleed cross-flow filtration system with low and highly negatively charged polystyrene–polyacrylic acid core-shell particles. In addition, an added procedure to determine the irremovability of cakes using FDG was also proposed. Comparing layers formed in the presence and absence of calcium ions revealed that layers formed without calcium ions had significantly lower cohesive strength than layers formed in the presence of calcium ions, which is explained by the bridging effect between negatively charged particles and calcium ions. Results also confirmed more cohesive cakes formed by high negative charge particles in the presence of calcium compared to lower negative charge particles. Hence, it was demonstrated that FDG can be used to assess the cohesive strength ((ir)removability) of cake layers, and to study how cake cohesive strength depends on foulant surface charge and ionic composition of the solution.
机译:膜的污染仍然是膜技术应用中的一个重要限制因素。因此,仍然需要深入理解哪些参数影响结垢层的(IR)可拆卸性,以及污垢后面的机制。在这项研究中,使用流体动态测量(FDG)来研究带负电荷的污垢颗粒和阳离子在蛋糕内粘性强度之间的电荷效应的影响。在膜操作期间估计结垢蛋糕的厚度和内聚强度,其中微滤(MF)膜在具有低且带负电荷的聚苯乙烯 - 聚丙烯酸核 - 壳颗粒的进料和渗出的横流过滤系统中核成。另外,还提出了使用FDG确定蛋糕不可动作的添加步骤。在存在和不存在钙离子的情况下形成的比较层表明,在没有钙离子的情况下形成的层显着降低了钙离子存在下形成的层的粘性强度,这通过带负电荷颗粒和钙离子之间的桥接效应来解释。结果还确认了与较低的负电荷颗粒相比,在钙存在下通过高负电荷颗粒形成的更多内粘性蛋糕。因此,证明FDG可用于评估蛋糕层的内聚强度((IR)可除去),并研究蛋糕粘性强度如何取决于污垢表面电荷和溶液离子组成。

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