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Defects Can Increase the Melting Temperature of DNA-Nanoparticle Assemblies

机译:缺陷可能会增加DNA-纳米颗粒组件的融解温度

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摘要

DNA-gold nanoparticle assemblies have shown promise as an alternative technology to DNA microarrays for DNA detection and RNA profiling. Understanding the effect of DNA sequences on the melting temperature of the system is central to developing reliable detection technology. We studied the effects of DNA base-pairing defects, such as mismatches and deletions, on the melting temperature of DNA-nanoparticle assemblies. We found that, contrary to the general assumption that defects lower the melting temperature of DNA, some defects increase the melting temperature of DNA-linked nanoparticle assemblies. The effects of mismatches and deletions were found to depend on the specific base pair, the sequence, and the location of the defects. Our results demonstrate that the surface-bound DNA exhibit hybridization behavior different from that of free DNA. Such findings indicate that a detailed understanding of DNA-nanoparticle assembly phase behavior is required for quantitative interpretation of DNA-nanoparticle aggregation.
机译:DNA金纳米颗粒组件已显示出有望成为DNA微阵列的替代技术,用于DNA检测和RNA分析。了解DNA序列对系统解链温度的影响对于开发可靠的检测技术至关重要。我们研究了DNA碱基配对缺陷(如错配和缺失)对DNA纳米粒子组件熔化温度的影响。我们发现,与缺陷会降低DNA的熔化温度的一般假设相反,某些缺陷会增加DNA连接的纳米粒子组件的熔化温度。发现错配和缺失的影响取决于特定的碱基对,序列和缺陷的位置。我们的结果表明,表面结合的DNA表现出与游离DNA不同的杂交行为。这些发现表明对DNA-纳米颗粒聚集相的定量解释需要对DNA-纳米颗粒组装相行为的详细了解。

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  • 期刊名称 other
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  • 年(卷),期 -1(110),33
  • 年度 -1
  • 页码 16393–16396
  • 总页数 10
  • 原文格式 PDF
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