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Electrically Conductive Bulk Composites through a Contact-Connected Aggregate

机译:通过接触连接的骨料的导电大块复合材料

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摘要

This paper introduces a concept that allows the creation of low-resistance composites using a network of compliant conductive aggregate units, connected through contact, embedded within the composite. Due to the straight-forward fabrication method of the aggregate, conductive composites can be created in nearly arbitrary shapes and sizes, with a lower bound near the length scale of the conductive cell used in the aggregate. The described instantiation involves aggregate cells that are approximately spherical copper coils-of-coils within a polymeric matrix, but the concept can be implemented with a wide range of conductor elements, cell geometries, and matrix materials due to its lack of reliance on specific material chemistries. The aggregate cell network provides a conductive pathway that can have orders of magnitude lower resistance than that of the matrix material - from 1012 ohm-cm (approx.) for pure silicone rubber to as low as 1 ohm-cm for the silicone/copper composite at room temperature for the presented example. After describing the basic concept and key factors involved in its success, three methods of implementing the aggregate into a matrix are then addressed – unjammed packing, jammed packing, and pre-stressed jammed packing – with an analysis of the tradeoffs between increased stiffness and improved resistivity.
机译:本文介绍了一个概念,该概念允许使用通过接触连接并嵌入复合材料内的顺应性导电聚合单元网络来创建低电阻复合材料。由于聚集体的直接制造方法,可以以几乎任意的形状和尺寸产生导电复合材料,在聚集体中使用的导电单元的长度尺度附近具有较低的界限。所描述的实例涉及聚合单元,该聚合单元在聚合物基质中近似为球形的铜线圈线圈,但是由于其不依赖于特定材料,因此该概念可以使用多种导体元件,单元几何形状和基质材料来实现化学。聚合电池网络提供的导电路径的电阻可以比基体材料的电阻低几个数量级-从10 12 ohm-cm(大约)到纯硅橡胶,低至1 ohm对于本实施例,在室温下有机硅/铜复合材料为-cm。在描述了其成功所涉及的基本概念和关键因素之后,然后介绍了将集料实施到矩阵中的三种方法-无堵塞填料,堵塞填料和预应力堵塞填料-并分析了增加刚度和改进后的权衡电阻率。

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