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Strong enhancement of photoresponsivity with shrinking the electrodes spacing in few layer GaSe photodetectors

机译:通过缩小几层GaSe光电探测器中的电极间距来大大增强光响应性

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摘要

A critical challenge for the integration of optoelectronics is that photodetectors have relatively poor sensitivities at the nanometer scale. Generally, a large electrodes spacing in photodetectors is required to absorb sufficient light to maintain high photoresponsivity and reduce the dark current. However, this will limit the optoelectronic integration density. Through spatially resolved photocurrent investigation, we find that the photocurrent in metal-semiconductor-metal (MSM) photodetectors based on layered GaSe is mainly generated from the region close to the metal-GaSe interface with higher electrical potential. The photoresponsivity monotonically increases with shrinking the spacing distance before the direct tunneling happens, which was significantly enhanced up to 5,000 AW−1 for the bottom Ti/Au contacted device. It is more than 1,700-fold improvement over the previously reported results. The response time of the Ti/Au contacted devices is about 10–20 ms and reduced down to 270 μs for the devices with single layer graphene as metallic electrodes. A theoretical model has been developed to well explain the photoresponsivity for these two types of device configurations. Our findings realize reducing the size and improving the performance of 2D semiconductor based MSM photodetectors simultaneously, which could pave the way for future high density integration of optoelectronics with high performances.
机译:光电集成的关键挑战是光电探测器在纳米级的灵敏度相对较差。通常,在光电检测器中需要较大的电极间距以吸收足够的光以维持高的光响应性并减少暗电流。但是,这将限制光电集成密度。通过空间分辨光电流研究,我们发现基于层状GaSe的金属-半导体-金属(MSM)光电探测器中的光电流主要产生于靠近具有较高电势的金属-GaSe界面的区域。在直接隧穿发生之前,随着间隔距离的减小,光敏性单调增加。对于底部Ti / Au接触器件,光敏性显着提高到5,000 AW -1 。它比以前报告的结果提高了1,700倍以上。 Ti / Au接触器件的响应时间约为10–20μs,对于以单层石墨烯作为金属电极的器件,响应时间可降低至270μs。已经开发出理论模型来很好地解释这两种类型的设备配置的光响应性。我们的发现实现了同时减小基于2D半导体的MSM光电探测器的尺寸并提高其性能,这可能为未来高性能的光电电子的高密度集成铺平了道路。

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