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Ultra-high on-chip optical gain in erbium-based hybrid slot waveguides

机译:基于的混合缝隙波导中的超高片上光学增益

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摘要

Efficient and reliable on-chip optical amplifiers and light sources would enable versatile integration of various active functionalities on the silicon platform. Although lasing on silicon has been demonstrated with semiconductors by using methods such as wafer bonding or molecular beam epitaxy, cost-effective mass production methods for CMOS-compatible active devices are still lacking. Here, we report ultra-high on-chip optical gain in erbium-based hybrid slot waveguides with a monolithic, CMOS-compatible and scalable atomic-layer deposition process. The unique layer-by-layer nature of atomic-layer deposition enables atomic scale engineering of the gain layer properties and straightforward integration with silicon integrated waveguides. We demonstrate up to 20.1 ± 7.31 dB/cm and at least 52.4 ± 13.8 dB/cm net modal and material gain per unit length, respectively, the highest performance achieved from erbium-based planar waveguides integrated on silicon. Our results show significant advances towards efficient on-chip amplification, opening a route to large-scale integration of various active functionalities on silicon.
机译:高效,可靠的片上光放大器和光源将能够在硅平台上实现各种有源功能的多功能集成。尽管已经通过使用诸如晶片键合或分子束外延的方法在半导体上证明了在硅上发射激光,但是仍然缺乏用于CMOS兼容有源器件的经济有效的批量生产方法。在这里,我们报告了具有整体式,CMOS兼容且可扩展的原子层沉积工艺的基于hybrid的混合缝隙波导中的超高片上光学增益。原子层沉积的独特逐层特性使增益层特性的原子级工程化和与硅集成波导的直接集成成为可能。我们分别演示了高达20.1±7.31dB / cm和至少52.4±13.8dB / cm的单位长度净模态和材料增益,这是集成在硅上的基平面波导实现的最高性能。我们的结果表明,在有效的片上放大方面取得了重大进展,这为在硅上大规模集成各种有源功能开辟了道路。

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