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Dealing with image shifting in 3D ToF-SIMS depth profiles

机译:处理3D ToF-SIMS深度剖面中的图像偏移

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摘要

The high sputter efficiency and low damage of gas cluster ion beams have enabled depth profiling to greater depths within organic samples using time-of-flight secondary ion mass spectrometry (ToF-SIMS). Due to the typically fixed geometry of the ion sources used in ToF-SIMS, as one digs into a surface, the position sampled by ion beams shifts laterally. This causes a lateral shift in the resulting images that can become quite significant when profiling down more than one micron. Here, three methods to compensate for this image shifting are presented in order to more accurately stack the images to present a 3D representation. These methods include (1) using software to correct the image shifts post-acquisition, (2) correcting the sample height during acquisition, and (3) adjusting the beam position during acquisition. The advantages and disadvantages of these methods are discussed. It was found that all three methods were successful in compensating for image shifting in ToF-SIMS depth profiles resulting in a more accurate display of the 3D data. Features from spherical objects that were ellipsoidal prior to shifting were seen to be spherical after correction. Software shifting is convenient as it can be applied after data acquisition. However, when using software shifting, one must take into account the scan size and the size of the features of interest as image shifts can be significant and can result in cropping of features of interest. For depth profiles deeper than a few microns, hardware methods should be used as they preserve features of interest within the field of view regardless of the profile depth. Software shifting can also be used to correct for small shifts not accounted for by hardware methods. A combination of hardware and software shift correction can enable correction for a wide range of samples and profiling depths. The scripts required for the software shifting demonstrated herein are provided along with tutorials in the supplementary material.
机译:气体团簇离子束的高溅射效率和低损伤性使得能够使用飞行时间二次离子质谱(ToF-SIMS)对有机样品中的深度进行深度剖析。由于在ToF-SIMS中使用的离子源通常具有固定的几何形状,因此当人们深入研究某个表面时,离子束采样的位置会横向移动。这会导致结果图像发生横向偏移,当向下剖析多于一个微米时,该偏移会变得非常明显。在此,提出了三种补偿此图像偏移的方法,以便更准确地堆叠图像以呈现3D表示。这些方法包括(1)使用软件来校正采集后的图像偏移;(2)在采集期间校正样本高度;以及(3)在采集期间调整光束位置。讨论了这些方法的优缺点。发现这三种方法均能成功补偿ToF-SIMS深度剖面中的图像偏移,从而可以更精确地显示3D数据。校正后,来自球形物体的椭圆形物体在平移之前的特征被视为球形。软件转移很方便,因为它可以在数据采集后应用。但是,在使用软件移位时,必须考虑扫描尺寸和感兴趣特征的尺寸,因为图像移位可能很明显,并且可能导致感兴趣特征的裁剪。对于比几微米深的深度剖面,应使用硬件方法,因为无论轮廓深度如何,它们都会在视场内保留感兴趣的特征。软件移位也可以用于校正硬件方法未解决的微小移位。硬件和软件偏移校正的组合可以实现对各种样本和轮廓深度的校正。本文演示的软件转换所需的脚本与补充材料中的教程一起提供。

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