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Indirect Time-of-Flight Depth Sensor with Two-Step Comparison Scheme for Depth Frame Difference Detection

机译:具有两步比较方案的间接飞行时间深度传感器用于深度帧差异检测

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摘要

A depth sensor with integrated frame difference detection is proposed. Instead of frame difference detection using light intensity, which is vulnerable to ambient light, the difference in depth between successive frames can be acquired. Because the conventional time-of-flight depth sensor requires two frames of depth-image acquisition with four-phase modulation, it has large power consumption, as well as a large area for external frame memories. Therefore, we propose a simple two-step comparison scheme for generating the depth frame difference in a single frame. With the proposed scheme, only a single frame is needed to obtain the frame difference, with less than half of the power consumption of the conventional depth sensor. Because the frame difference is simply generated by column-parallel circuits, no access of the external frame memory is involved, nor is a digital signal processor. In addition, we used an over-pixel metal–insulator–metal capacitor to store temporary signals for enhancing the area efficiency. A prototype chip was fabricated using a 90 nm backside illumination complementary metal–oxide–semiconductor (CMOS) image sensor process. We measured the depth frame difference in the range of 1–2.5 m. With a 10 MHz modulation frequency, a depth frame difference of >10 cm was successfully detected even for objects with different reflectivity. The maximum relative error from the difference of the reflectivity (white and wooden targets) was <3%.
机译:提出了一种集成帧差检测的深度传感器。代替使用容易受到环境光影响的光强度来检测帧差异,可以获取连续帧之间的深度差。因为传统的飞行时间深度传感器需要两帧具有四相调制的深度图像采集,所以它具有很大的功耗,并且有很大的外部存储空间。因此,我们提出了一种简单的两步比较方案,用于在单个帧中生成深度帧差。利用所提出的方案,仅需要单个帧来获得帧差,而小于传统深度传感器的功耗的一半。因为帧差仅由列并行电路产生,所以不涉及外部帧存储器的访问,也不涉及数字信号处理器。此外,我们使用了超像素金属-绝缘体-金属电容器来存储临时信号,以提高面积效率。原型芯片是使用90 nm背面照明互补金属-氧化物-半导体(CMOS)图像传感器工艺制造的。我们测量的深度框架差异在1–2.5 m的范围内。使用10 MHz的调制频率,即使对于反射率不同的物体,也可以成功检测到大于10 cm的深度帧差异。反射率差异(白色和木制目标)的最大相对误差<3%。

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