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Synergistic Effects of Functional CNTs and h-BN on Enhanced Thermal Conductivity of Epoxy/Cyanate Matrix Composites

机译:功能性CNT和h-BN对环氧/氰酸盐基复合材料导热性能的协同影响

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摘要

Epoxy/cyanate resin matrix composites (AG80/CE) with improved thermal conductivity and mechanical properties were obtained with synergetic enhancement with functional carbon nanotubes (f-CNTs) and hexagonal boron nitride (h-BN). AG80/CE performed as polymeric matrix and h-BN as conductivity filler which formed the main thermal conductivity channels. Small amounts of f-CNTs were introduced to repair defects in conductivity channels and networks. To confirm the synergetic enhancements, the thermal conductivity was investigated and analyzed with Agari’s model. Results indicated that with introduction of 0.5 wt% f-CNTs, the thermal conductivity coefficient (ƛ) increased to 0.745 W/mk, which is 1.38 times that of composites with just h-BN. Furthermore, the flexural strength and modulus of composites with 0.5 wt% f-CNTs were 85 MPa and 3.5 GPa. The glass transition temperature (Tg) of composites with 0.4 wt% was 285 °C and the initial decomposition temperature (T5%) was 385 °C, indicating outstanding thermal stability. The obtained h-BN/f-CNTs reinforced AG80/CE composites present great potential for packaging continuous integration and miniaturization of microelectronic devices.
机译:通过功能性碳纳米管(f-CNT)和六方氮化硼(h-BN)的协同增强,获得了具有改善的导热性和机械性能的环氧/氰酸酯树脂基复合材料(AG80 / CE)。 AG80 / CE用作聚合物基质,h-BN用作导热填料,形成了主要的导热通道。引入了少量的f-CNT,以修复电导率通道和网络中的缺陷。为了确认协同作用的增强,使用Agari模型对导热系数进行了研究和分析。结果表明,引入0.5 wt%的f-CNTs,导热系数(ƛ)增加到0.745 W / mk,是仅含h-BN的复合材料的1.38倍。此外,具有0.5wt%的f-CNT的复合材料的弯曲强度和模量为85MPa和3.5GPa。具有0.4重量%的复合物的玻璃化转变温度(Tg)为285℃,并且初始分解温度(T5%)为385℃,表明优异的热稳定性。所得的h-BN / f-CNTs增强的AG80 / CE复合材料具有包装微电子器件的持续集成和小型化的巨大潜力。

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