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Comparison of the bonding strengths of second- and third-generation light-emitting diode light-curing units

机译：第二代和第三代发光二极管光固化单元粘合强度的比较

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摘要

ObjectiveWith the introduction of third-generation light-emitting diodes (LEDs) in dental practice, it is necessary to compare their bracket-bonding effects, safety, and efficacy with those of the second-generation units.

机译：目的随着牙科实践中引入第三代发光二极管（LED），有必要将其与第二代装置的托槽粘接效果，安全性和功效进行比较。

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期刊名称 Korean Journal of Orthodontics
作者
Hee-Min Lee; Sang-Cheol Kim; Kyung-Hwa Kang; Na-Young Chang;
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作者单位

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年(卷),期 2016(46),6
年度 2016
页码 364–371
总页数 8
原文格式 PDF
正文语种
中图分类口腔科;牙科材料学;
关键词
Light-emitting diodes light-curing unit Shear bond strength;

机译：发光二极管光固化机;剪切强度;

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专利

1. A COMPARISON OF THE SHEAR BOND STRENGTH OF ORTHODONTIC BRACKETS BONDED WITH LIGHT-EMITTING DIODE AND HALOGEN LIGHT-CURING UNITS [J] . ABTAHI S.M., KHAMVERDI Z. Journal of Dentistry of Tehran University of Medical Sciences . 2006,第3期

机译：发光二极管与卤代光单元粘接的正畸支架的抗剪强度比较
2. Shear bond strength of a bracket-bonding system cured with a light-emitting diode or halogen-based light-curing unit at various polymerization times [J] . Sanjay Prasad Gupta, Basanta Kumar Shrestha Clinical, Cosmetic and Investigational Dentistry . 2018,第10期

机译：在不同聚合时间用发光二极管或卤素基光固化单元固化的托槽粘合体系的剪切粘合强度
3. In-vitro bond strengths and clinical failure rates of metal brackets bonded with different light-emitting diode units and curing times [J] . Oz Abdullah Alper, Oz Aslihan Zeynep, Arici Selim American Journal of Orthodontics and Dentofacial Orthopedics . 2016,第2期

机译：用不同的发光二极管单元粘合的金属支架的体外粘合强度和临床失败率以及固化时间
4. The Effects of Hydroxyapatite on Demineralization Resistance and Bonding Strength in Light-Curing Glass lonomer Dental Cement [C] . J.H. Kim, Y.K. Lee, B.J. Choi International Symposium on Ceramics in Medicline . 2009

机译：羟基磷灰石对光固化玻璃离聚物牙髓脱矿抗性和粘合强度的影响
5. Psychological Symptoms, Family Functioning, and Religious Coping in Second- and Third-Generation Holocaust Survivors [D] . Wasserman, Melissa M. 2017

机译：第二代和第三代大屠杀幸存者的心理症状，家庭功能和宗教应对
6. Shear bond strength of a bracket-bonding system cured with a light-emitting diode or halogen-based light-curing unit at various polymerization times [O] . Sanjay Prasad Gupta, Basanta Kumar Shrestha 2018

机译：在不同的聚合时间用发光二极管或卤素基光固化单元固化的支架粘合体系的剪切粘合强度
7. Evaluation of Different Light-Curing Units—Light-Emitting Diodes and Quartz–Tungsten–Halogen-Based Light-Curing Units in Polymerization of Posterior Composite: An In Vitro Study [O] . R. Bansal, M. Bansal, S. Walia, 2018

机译：不同光固化单位发光二极管和石英 - 钨 - 卤素光固化单元在后复合材料的聚合中的光纤 - 体外研究

Comparison of the bonding strengths of second- and third-generation light-emitting diode light-curing units

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