Thermal Resistance Simulation for CoF Packages

著录项

• 来源
  《清华大学学报（英文版）》 |2015年第3期|277-284|共8页
• 作者

  Chuan Chen; Qian Wang; Xiaotian Meng; Lin Tan; Jian Wang; Chengqiang Cui; Jian Cai;

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• 作者单位

  Institute of Microelectronics, Tsinghua University, Beijing 100084, China;

  Institute of Microelectronics, Tsinghua University, Beijing 100084, China;

  Institute of Microelectronics, Tsinghua University, Beijing 100084, China;

  Institute of Microelectronics, Tsinghua University, Beijing 100084, China;

  AKM Electronics Technology(Suzhou)Company Ltd., Suzhou 215000, China;

  AKM Electronics Technology(Suzhou)Company Ltd., Suzhou 215000, China;

  Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology, Tsinghua University, Beijing 100084, China.;

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• 收录信息 中国科学引文数据库(CSCD);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词